!
此版本为量产版本的第一次小批试产，和之前的测试版变更如下：
- 电阻，电容，电感统一改用0201封装。
- 增加STM8L MCU，负责组网，跳频，等底层通讯，也有不带MCU的版本。
- 预留了T/R线，方便日后新增的1W扩展模块级联。
- 体积由之前的1617mm缩小为13.516.5，并预留了屏蔽罩位置。
- 由2层改为4层，由FR4改为高端生益料，增加整体的抗干扰、稳定性、高频特性。
- 晶体由之前的30ppm改为10ppm。
English:
This version is the production of the first batch of small trial production, and the previous version of the test changes are as follows:
- Resistance, capacitance, inductance unified switch to 0201 package.
Increase STM8L MCU, responsible for networking, frequency hopping, and other low-level communications, there are versions without MCU. - Reserved T / R line, to facilitate the future of the new 1W expansion module cascade.
- The volume from the previous 1617mm reduced to 13.516.5, and set aside the shield cover position.
- From 2 to 4 layers, from FR4 to high-end raw materials, to increase the overall anti-jamming, stability, high-frequency characteristics.
The crystal was changed from 30 ppm to 10 ppm.
!
